Basic Soldering For Electronics Pace Handbook Of North

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Glenn Blackwell

Purdue University

Electrical & Computer Engineering Technology Dept.

A solder gun is a pistol-shaped iron, typically running at 100W or more, and is completely unsuitable for soldering modern electronic components: they're too hot, heavy and unwieldy for micro-electronics use. Plumbing, maybe.! Soldering irons are best used along with a heat-resistant bench-type holder, so that the. Basic Soldering For Electronics Pace Handbook Definition. List of games Games are arranged alphabetically by romaji title; is used.

Customize this course by selecting only the days/modules that meet your training requirements. Using both lead and lead-free alloys, Hand Soldering Operator Certification introduces the basics of soldering in Wires & Terminals, Through-Hole and Surface Mount Technologies and Rework. Students will learn about electrostatic discharge, industry terminology, equipment familiarization and the. One of the most commonly used solder alloys is solder that is 60% tin (Sn) and 40% lead (Pb). Another commonly used solder alloy is solder that is 63% tin (Sn) and 37% lead (Pb) – this works especially well on small electronic parts. Recently, there is big increase in use of lead-free solder since lead fumes can be dangerous for health. Solder pastes (based on SnCuAg). The tests performed typically include:. Solderability with SnCuAg solder. Resistance to Solder Heat For the SMDs reclassification of the moisture sensitivity level (MSL) at a peak reflow temperature of 260°C is required in addition to solderability validation. The MSL reclassification is performed on the.

UTEC SMT Course 2014 Web Page

The Universidad De Ingenieria & Technologia (UTEC) in Lima, Peru, is a new engineering university in South America. Their web site is www.utec.edu.pe.Electronics is an important part of their curriculum, so together we have developed a short course on Surface Mount Technology (SMT) to introduce their students to three aspects of the use of SMT:

vBasics of SMT components and assembly processes

vPCB design using SMT components, including high-current and high-speed circuits

vBasic hand assembly, assisted hand assembly, and rework/repair of SMT-based assemblies.

The text for the course is Blackwell & Hollomon, Surface-Mount Technology for PC Boards, 2nd edition, Thompson/Delmar Learning, 2006.

Here is the errata sheet for the text: B&H Errata

The reason for the course is the continuing increase in the impact of electronics in many areas of technology. An example of electronics’ impact on the automotive industry is here: Automotive Electronics

Here is a basic introduction to surface mount technology, courtesy of Radio-Electronics magazine: R-E SMT Introduction

Cross-section of an example PC board, which shows how SMT components allow easier routing, and in many cases fewer layers, than through-hole technology (THT) components.

THT component leads require that every layer be clear of the hole, while SMT components only affect routing on the surface layer to which they will be soldered.

The course will consist of morning and afternoon lectures, and morning and afternoon laboratories.

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`SMT decoupling caps on the bottom of a BGA board.

References for the course, in addition to the textbook, include:

vIntel Packaging Handbook: http://www.intel.com/design/packtech/packbook.htm, chapter 1 “Component Surface Mount Technology”, and chapter 2 “SMT Board Assembly Recommendations”.

vTexas Instruments basic SMT component handling, process recommendations, and basic repair/rework recommendations: TI AN-2029

Basic soldering for electronics pace handbook of north america

vSilicon Laboratories Application Note on hand soldering QFP packages: Hand Soldering Tutorial for Fine Pitch QFP Devices

vConceptronic Reflow Technology Handbook: Conceptronic RT Handbook

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LLP/QFN, one of the newer SMT packages discussed in the course.

The course reference for LLP/QFN packages is TI Application Note AN-1187, “Leadless Leadframe Package”: TI AN1187 LLP

And for QFN PCB design, TI “QFN Design Guide”: TI SLMA006 QFN

For any small SMT package, thermal transfer of heat to the board is important. This issue is discussed in TI AN-1520, “A Guide to Board Layout for Best Thermal Resistance for Exposed Packages”:TI AN-1520

Course References:

Thermal Issues, IC:

Texas Instruments “Understanding IC Package Power Capabilities”, http://www.ti.com/lit/an/snva509a/snva509a.pdf

Thermal Issues, PCB:

Ultracad Designs: http://www.ultracad.com/article_outline.htm

Saturn PCB Toolkit: http://www.saturnpcb.com/pcb_toolkit.htm

Blackwell & Hollomon,chapter 5 section 5.8

Texas Instruments application note AN-1520: http://www.ti.com/lit/an/snva183b/snva183b.pdf

High-Speed, By-pass Capacitors:

Ultracad Designs: http://www.ultracad.com/article_outline.htm

Blackwell & Hollomon, chapter 5, section 5-10

Xilinx Vertex-6 PCB Design Guide: http://www.xilinx.com/support/documentation/user_guides/ug203.pdf

Wizards in high-speed design:

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Doug Brooks: http://www.ultracad.com

Eric Bogatin: http://bethesignal.com/bogatin

Howard Johnson: http://www.sigcon.com

Lee Ritchey: http://speedingedge.com

General SMT References

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General SMT Information:

  • SMT Net: www.smtnet.com
  • SMT Magazine: www.smtmagazine.com
  • Surface MountTechnology Assn.: www.smta.org
  • Intel Packaging Databook chapter 1, “Component Surface Mount Technology” and chapter 2, “SMT Board Assembly Recommendations”, available at www.intel.com/design/packtech/packbook.htm
  • Circuit Technology’s newsletter and white papers: www.circuitnet.com
  • High-speed and bypass capacitor information from UltraCAD Design, Inc., available at www.ultracad.com .

Solder paste information:

  • Amtech Solder: www.amtechsolder.com
  • Kester Solder: www.kester.com

Hand soldering and rework & repair:

  • Metcal Corp: www.metcal.com
  • Pace Corp.:www.paceworldwide.com

Circuit board design:

  • PCB Design & Fabrication magazine: www.pcdandf.com
  • PCB Standards for design, manufacturing, and testing, the IPC: www.ipc.org

Lead Free Solder and related Tin Whisker problems:

·IPC Leadfree Site

·NASA Tin Whisker Basics

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·Intel Packaging Databook chapter 2, “Component Surface Mount Technology”, available at www.intel.com/design/packtech/packbook.htm

Basic Soldering For Electronics Pace Handbook Of North American

This page last updated 08 August, 2014